By assigning a dedicated Manufacturing Engineer to each project and maintaining precise documentation, we quickly identify potential problems before they affect your time-to-market. Our experts carefully review the manufacturability of designs for precision and formulate recommendations for design enhancement. The result is cost-effective, high quality electronics products manufactured to your exact specifications.

Manufacturing Engineering Services:

• Lead-free Manufacturing Processes
• Program/Maintenance Support
• Using formulas developed in-house, our Manufacturing Engineers fabricate solder paste stencils and develop pick-and-place programs for prototype assembly and production runs.
• Manufacturing Process Instruction (MPI)
• Detailed flow charts that map out each step in the manufacturing process, ensuring accuracy and timely project completion.
• Prototype Support and Reporting
• Reports that detail our prototype reviews and recommendations upon completion of first-builds.
• Manufacturing Feedback Reporting
• Reviews and recommendations issued for ongoing order completion.
• Documentation Review
• Analysis of customer-provided documentation for accuracy.
• Product Introduction
• Identification and fabrication of special work instructions and production fixtures needed to complete the run at maximum efficiency. Includes Design-For-Manufacturability (DFM) review and strategic product introduction strategies.

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BGA and Micro BGA Experts

• Capable of 0.0157Mil (0.4mm pitch) placement
• More than 10 years experience with BGA
• Approximately 100k+/month BGA placements
• Largest number of BGA (60) placed on one board
• Largest BGA (1,900 balls) placed on a board
• BGA placement on both sides of PCB
• BGA Re-Work stations
• 2D X-Ray inspection

Workmanship Standard
EMI Asia Limited performs all manufacturing assembly services in conformance with the workmanship criteria of IPC-A-610, Class 2,3. EMI Asia Limited can build to the requirements of IPC-A-610 Class 2,3 as far as the provided design and materials allow.